John J. Callahan, Ph.D. is a Research Scientist, Senior Staff at Lockheed Martin Space in Billerica, MA. John received his PhD and Masters degrees from the Georgia Institute of Technology and BSEE from the University of Lowell. His graduate work focused on optoelectronic heterogenous integration creating one of the first optical transceivers. Dr. Callahan has a career spanning over two decades advancing commercial semiconductor, assembly, and optoelectronic technologies. His current efforts at Lockheed Martin focus on advancing GaN technology for high-temperature applications, integrated optoelectronics and heterogenous integration utilizing chiplet technology for advanced processing platforms.
Prior to joining Lockheed Martin, John was the VP of Technology at BRIDG, a 200mm semiconductor fabrication organization. While at BRIDG he spearheaded the creation and managing of BRIDG’s technology roadmap, managed the operations and facilities teams, and provided technical sales by creating processing solutions to customer requests. Prior to BRIDG, he served at the Vice President of Engineering at SemiNex, a developer of long wavelength high-power semiconductor lasers. He oversaw both engineering and operations, managing the international supply chain. He was responsible for the creation of eight major product lines and over 300 products for the military, industrial, consumer and datacom markets. Before his tenure at Seminex, John served as the Director of Engineering at Cubic Wafer, where he led the efforts to create manufacturing process for 3D Heterogeneous Integration assembly techniques. His organization was one of the first to produce through silicon vias (TSV’s) and 3D assembly using microcontacts. Prior to Cubic Wafer, he was the Director of Research and Development at Xanoptix where he oversaw Process, Mechanical, IC Design Engineering teams to create a high-speed large aggregated data optical transceiver for the datacom market.
