MTL prefers to list sponsors with full names instead of abbreviations. Here is a guide for your reference.
However, these acronyms do not need to be spelled out in full.
IBM (MIG member)
IEEE
TSMC (MIG member)
MARCO
NIH
NSF
NASA
DRIFT-MURI
SRC
There are some acronyms that are accepted as commonly understood in this field, and there are many that may be unfamiliar to a general audience. Please spell out your acronyms at least once.
Some Common Technical Acronyms
Acronym
Full Name
ADC
Analog-to-Digital Converters
AFE
Analog-front-end
ALD
Atomic layer deposition
CMP
Chemical mechanical polishing
CMOS
Complementary metal–oxide–semiconductor
CNT
Carbon Nanotubes
DRIE
Deep-reactive ion etching
FET
Field-effect transistor
MOSFET
Metal–oxide–semiconductor field-effect transistor
U.S. Government Agency Acronyms
Acronym
Full Name
AFOSR
U.S. Air Force Office of Scientific Research
AFRL
U.S. Air Force Research Laboratory
ARL
U.S. Army Research Laboratory
ARL-CDQI
U.S. Army Research Laboratory Center for Distributed Quantum Information
ARPA-E
Advanced Research Projects Agency – Energy (DOE)
DARPA
Defense Advanced Research Projects Agency
YFA
DARPA Young Faculty Award DoD, U.S. Department of Defense
DOE
Department of Energy
EFRC
U.S. Department of Energy: Energy Frontier Research Center (Center for Excitonics)
DTRA
U.S. DoD Defense Threat Reduction Agency
IARPA
Intelligence Advanced Research Projects Activity
NASA
National Aeronautics and Space Administration
NDSEG
National Defense Science and Engineering Graduate Fellowship
NIH
National Institutes of Health
NCI
National Cancer Institute
NSF
National Science Foundation
CIQM
NSF Center for Integrated Quantum Materials
CSNE
NSF Center for Sensorimotor Neural Engineering
E3S
NSF Center for Energy Efficient Electronics Science
GRFP
NSF Graduate Research Fellowship Program
MRSEC
NSF Materials Research Science and Engineering Centers